FLEX CIRCUITS MATERIAL

 

FEATURES:

  • Single Side
  • Doulbe Side
  • Multilayer
  • Stiffener
  • Plating
  • Masking
  • Shielding
  • Forming

PLATING:

  • Finishes
    • Solder
    • Gold
    • Nickel
    • Tin
    • Others

 

MATERIALS:

  • Base Material
    • Polyimide (Kapton) .0005 to 5 mils
    • Polyester: (Mylar) .001 to 15 mils
    • Other
  • Metals
    • Copper (Cu)
    • Beryllium Copper (BeCu)
    • Nickel
    • Stainless Steel
    • Aluminum
    • Other
    • Thickness (.0003 to .040 mils)
  • Coverlay
    • Polyimide
    • Polyester
    • LPI (photoimage)
  •  

     

Photo-Chem Etch Corporation
7710 San Fernando Road, Sun Valley, CA 91352
(818) 767-0071 Fax: (818) 767-3547
info@photo-chem.com
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